8800WI Wafer Bump 3D Vision Inspection

半导体解决方案

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8800WI Wafer Bump 3D Vision Inspection：
▶ Conduct with PASS Buffer when REWORK Part with Multiple NGs
▶ Function to start manufacturing with the REWORK Parts during
INSPECTION ATM Check
▶ Apply the LOAD PORT substitute loading system during UNLOADER PART
ATM inspection
▶ AIR CHUCK Works on Both 8-inch(200mm), 12inch(300mm) WAFER
▶ Users can output and monitor the designated DATA by Using the
self-developed SPC SW, such as data, defective images,
and charts.
▶ PEMTRON SMARTRON server system allows user to view and control each
device through one operation PC to monitoring the
operational status and SPC DATA of all equipment
▶ Using 3D Inspection Methodology to process the BUMP Inspection
▶ Reduce resources to check and debug the fault defects based on the
outstanding inspection precision

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